Copper (Cu)
Copper has been mined for 5,000 years. It is a reddish metal that takes on a bright luster. Malleable and ductile, it is a good conductor of heat and electricity.
Copper can occur naturally in large ore deposits of sulfides, oxides, and carbonates. It is also found in cuprite, malachite, azurite, chalcopyrite, bornite, and other minerals.
Copper's largest use is in the electrical industry, and its alloys, brass and bronze, are used in coins and gun metals. Copper is also used as both an agricultural poison and an algaecide. Copper compounds are widely used in analytical chemistry testing.
Copper powder, -100 mesh, 99%
CAS: 7440-50-8 Formule moléculaire: Cu Poids moléculaire (g/mol): 63.55 Numéro MDL: MFCD00010965 Clé InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonyme: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer CID PubChem: 23978 ChEBI: CHEBI:30052 Nom IUPAC: copper SMILES: [Cu]
Copper rod, 5mm (0.2in) dia, Puratronic™, 99.999% (metals basis)
CAS: 7440-50-8 Formule moléculaire: Cu Poids moléculaire (g/mol): 63.55 Numéro MDL: MFCD00010965 Clé InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonyme: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer CID PubChem: 23978 ChEBI: CHEBI:30052 Nom IUPAC: copper SMILES: [Cu]
Copper wire, 1.0mm (0.04in) dia, Puratronic™, 99.999% (metals basis)
CAS: 7440-50-8 Formule moléculaire: Cu Poids moléculaire (g/mol): 63.55 Numéro MDL: MFCD00010965 Clé InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonyme: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer CID PubChem: 23978 ChEBI: CHEBI:30052 Nom IUPAC: copper SMILES: [Cu]
Copper foil, 0.127mm (0.005in) thick, annealed, 99.9% (metals basis)
CAS: 7440-50-8 Formule moléculaire: Cu Poids moléculaire (g/mol): 63.55 Numéro MDL: MFCD00010965 Clé InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonyme: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer CID PubChem: 23978 ChEBI: CHEBI:30052 Nom IUPAC: copper SMILES: [Cu]
Copper powder, -625 mesh, APS 3.25-4.75 micron, 99.9% (metals basis)
CAS: 7440-50-8 Formule moléculaire: Cu Poids moléculaire (g/mol): 63.55 Numéro MDL: MFCD00010965 Clé InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonyme: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer CID PubChem: 23978 ChEBI: CHEBI:30052 Nom IUPAC: copper SMILES: [Cu]
Copper gauze, 140 mesh woven from 0.056mm (0.0022in) dia wire
CAS: 7440-50-8 Formule moléculaire: Cu Poids moléculaire (g/mol): 63.55 Numéro MDL: MFCD00010965 Clé InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonyme: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer CID PubChem: 23978 ChEBI: CHEBI:30052 Nom IUPAC: copper SMILES: [Cu]
Copper Thinfoil, 0.01mm (0.0004in) thick, 99.8% (metals basis)
CAS: 7440-50-8 Formule moléculaire: Cu Poids moléculaire (g/mol): 63.55 Numéro MDL: MFCD00010965 Clé InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonyme: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer CID PubChem: 23978 ChEBI: CHEBI:30052 Nom IUPAC: copper SMILES: [Cu]
Copper foil, 0.05mm (0.002in) thick, annealed, 99.8% (metals basis), Thermo Scientific Chemicals
CAS: 7440-50-8 Formule moléculaire: Cu Poids moléculaire (g/mol): 63.55 Numéro MDL: MFCD00010965 Clé InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonyme: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer CID PubChem: 23978 ChEBI: CHEBI:30052 Nom IUPAC: copper SMILES: [Cu]
Copper foil, 0.05mm (0.002in) thick, annealed, 99.8% (metals basis)
CAS: 7440-50-8 Formule moléculaire: Cu Poids moléculaire (g/mol): 63.55 Numéro MDL: MFCD00010965 Clé InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonyme: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer CID PubChem: 23978 ChEBI: CHEBI:30052 Nom IUPAC: copper SMILES: [Cu]
Copper foil, 0.5mm (0.02in) thick, Puratronic™, 99.998% (metals basis), Oxygen free
CAS: 7440-50-8 Formule moléculaire: Cu Poids moléculaire (g/mol): 63.55 Numéro MDL: MFCD00010965 Clé InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonyme: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer CID PubChem: 23978 ChEBI: CHEBI:30052 Nom IUPAC: copper SMILES: [Cu]
Copper foil, 0.25mm (0.01in) thick, annealed, 99.95% (metals basis), oxygen free
CAS: 7440-50-8 Formule moléculaire: Cu Poids moléculaire (g/mol): 63.55 Numéro MDL: MFCD00010965 Clé InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonyme: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer CID PubChem: 23978 ChEBI: CHEBI:30052 Nom IUPAC: copper SMILES: [Cu]
Copper wire, 0.5mm (0.02in) dia, Puratronic™, 99.999% (metals basis), Oxygen free
CAS: 7440-50-8 Formule moléculaire: Cu Poids moléculaire (g/mol): 63.55 Numéro MDL: MFCD00010965 Clé InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonyme: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer CID PubChem: 23978 ChEBI: CHEBI:30052 Nom IUPAC: copper SMILES: [Cu]
Copper wire, 1.0mm (0.04in) dia, Puratronic™, 99.999% (metals basis), Oxygen free
CAS: 7440-50-8 Formule moléculaire: Cu Poids moléculaire (g/mol): 63.55 Numéro MDL: MFCD00010965 Clé InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonyme: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer CID PubChem: 23978 ChEBI: CHEBI:30052 Nom IUPAC: copper SMILES: [Cu]
Copper shot, 8mm (0.3in) & down, ACS, 99.9+% (metals basis)
CAS: 7440-50-8 Formule moléculaire: Cu Poids moléculaire (g/mol): 63.55 Numéro MDL: MFCD00010965 Clé InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonyme: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer CID PubChem: 23978 ChEBI: CHEBI:30052 Nom IUPAC: copper SMILES: [Cu]
Copper shot, 13mm (0.5in) dia, 99.99% (metals basis), oxygen free
CAS: 7440-50-8 Formule moléculaire: Cu Poids moléculaire (g/mol): 63.55 Numéro MDL: MFCD00010965 Clé InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonyme: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer CID PubChem: 23978 ChEBI: CHEBI:30052 Nom IUPAC: copper SMILES: [Cu]