Elemental Metals
Filtered Search Results
| Form | Liquid |
|---|---|
| MDL Number | MFCD00161912 |
| Health Hazard 1 | H290-H302-H315-H317-H318 |
| DOT Information | Hazard Class: 8; Packaging Group: III |
| Chemical Name or Material | Copper etchant |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Density | 1.19 |
Zinc copper couple
CAS: 53801-63-1 Molecular Formula: CuZn Molecular Weight (g/mol): 128.93 MDL Number: MFCD00084851 InChI Key: TVZPLCNGKSPOJA-UHFFFAOYSA-N Synonym: zinc-copper couple,cu.zn,zinc copper,copper, compound with zinc 1:1,zinc-copper,brass alloy,zn copper,copper-zinc alloy,zinc copper couple,cu-zn PubChem CID: 10290809 IUPAC Name: copper;zinc SMILES: [Cu].[Zn]
| PubChem CID | 10290809 |
|---|---|
| CAS | 53801-63-1 |
| Molecular Weight (g/mol) | 128.93 |
| MDL Number | MFCD00084851 |
| SMILES | [Cu].[Zn] |
| Synonym | zinc-copper couple,cu.zn,zinc copper,copper, compound with zinc 1:1,zinc-copper,brass alloy,zn copper,copper-zinc alloy,zinc copper couple,cu-zn |
| IUPAC Name | copper;zinc |
| InChI Key | TVZPLCNGKSPOJA-UHFFFAOYSA-N |
| Molecular Formula | CuZn |
Copper, 99+%, turnings
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Zinc-copper couple, Copper content typically ca 1-4%
CAS: 53801-63-1 Molecular Formula: CuZn Molecular Weight (g/mol): 128.93 MDL Number: MFCD00084851 InChI Key: TVZPLCNGKSPOJA-UHFFFAOYSA-N Synonym: zinc-copper couple,cu.zn,zinc copper,copper, compound with zinc 1:1,zinc-copper,brass alloy,zn copper,copper-zinc alloy,zinc copper couple,cu-zn PubChem CID: 10290809 IUPAC Name: copper zinc SMILES: [Cu].[Zn]
| PubChem CID | 10290809 |
|---|---|
| CAS | 53801-63-1 |
| Molecular Weight (g/mol) | 128.93 |
| MDL Number | MFCD00084851 |
| SMILES | [Cu].[Zn] |
| Synonym | zinc-copper couple,cu.zn,zinc copper,copper, compound with zinc 1:1,zinc-copper,brass alloy,zn copper,copper-zinc alloy,zinc copper couple,cu-zn |
| IUPAC Name | copper zinc |
| InChI Key | TVZPLCNGKSPOJA-UHFFFAOYSA-N |
| Molecular Formula | CuZn |
Copper turnings, 99.9% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper turnings, 99+% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper powder, -100 mesh, 99%
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
| Name Note | 0.5mm (0.02 in.) dia. |
|---|---|
| Form | Wire |
| Health Hazard 3 | P201-P202-P260-P264b-P270-P272-P280g-P281-P302+P352-P308+P313-P333+P313-P363-P501c |
| MDL Number | MFCD00801098 |
| Solubility Information | Insoluble in water. |
| Health Hazard 1 | H317-H350-H372 |
| Chemical Name or Material | Copper Nickel wire |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Weight | ≈1.75g/m |
| Avg. Mol. Wt. or Mol. Wt. Range | Cu:Ni 55:45 wt% |
| Form | Wire |
|---|---|
| Health Hazard 3 | P201-P202-P260-P264b-P270-P272-P280g-P281-P302+P352-P308+P313-P333+P313-P363-P501c |
| MDL Number | MFCD00801098 |
| Color | Silver |
| Health Hazard 1 | H317-H350-H372 |
| Chemical Name or Material | Copper Nickle |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Molecular Formula | Cu:Ni 55:45 wt% |
| Odor | Odorless |
| Appearance | Silver-colored wire |
Copper flake, -325 mesh, 99% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper powder, -150 mesh, 99.5% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper powder, -100 mesh, 99.999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper plate, 6.35mm (0.25in) thick, 99.9% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper foil, 0.254mm (0.010in) thick, 99.9% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
Copper foil, 1.27mm (0.05in) thick, 99.9% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |