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Sputtering Targets

Sputtering targets are specialized materials employed for thin-film deposition in various industries, including electronics, energy, and textiles. These targets can be composed of different elemental or alloy compositions, such as pure metals or ceramics, and are bombarded by ions, causing atoms or molecules to be ejected from their surface. These particles then deposit on a substrate to create a thin, uniform film. Different types of sputtering targets exist, including planar or rotary targets and a range of materials, such as gold, silver, titanium, and tungsten. Their selection depends on different factors like the application requirements, material properties, and compatibility with the sputtering system.
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1 – 6 of 6 results
1

Copper sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.999% (metals basis)

CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]

PubChem CID 23978
CAS 7440-50-8
Molecular Weight (g/mol) 63.55
ChEBI CHEBI:30052
MDL Number MFCD00010965
SMILES [Cu]
Synonym cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer
IUPAC Name copper
InChI Key RYGMFSIKBFXOCR-UHFFFAOYSA-N
Molecular Formula Cu
2

Copper sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.999% (metals basis)

CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]

PubChem CID 23978
CAS 7440-50-8
Molecular Weight (g/mol) 63.55
ChEBI CHEBI:30052
MDL Number MFCD00010965
SMILES [Cu]
Synonym cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer
IUPAC Name copper
InChI Key RYGMFSIKBFXOCR-UHFFFAOYSA-N
Molecular Formula Cu
3

Copper sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.995% (metals basis)

CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]

PubChem CID 23978
CAS 7440-50-8
Molecular Weight (g/mol) 63.55
ChEBI CHEBI:30052
MDL Number MFCD00010965
SMILES [Cu]
Synonym cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer
IUPAC Name copper
InChI Key RYGMFSIKBFXOCR-UHFFFAOYSA-N
Molecular Formula Cu
4

Copper sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis)

CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]

PubChem CID 23978
CAS 7440-50-8
Molecular Weight (g/mol) 63.55
ChEBI CHEBI:30052
MDL Number MFCD00010965
SMILES [Cu]
Synonym cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer
IUPAC Name copper
InChI Key RYGMFSIKBFXOCR-UHFFFAOYSA-N
Molecular Formula Cu
5

Copper sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.999% (metals basis)

CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]

PubChem CID 23978
CAS 7440-50-8
Molecular Weight (g/mol) 63.55
ChEBI CHEBI:30052
MDL Number MFCD00010965
SMILES [Cu]
Synonym cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer
IUPAC Name copper
InChI Key RYGMFSIKBFXOCR-UHFFFAOYSA-N
Molecular Formula Cu
6

Copper sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.999% (metals basis)

CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]

PubChem CID 23978
CAS 7440-50-8
Molecular Weight (g/mol) 63.55
ChEBI CHEBI:30052
MDL Number MFCD00010965
SMILES [Cu]
Synonym cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer
IUPAC Name copper
InChI Key RYGMFSIKBFXOCR-UHFFFAOYSA-N
Molecular Formula Cu