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Foamtec UltraSOLV™ ScrubPADS™
Vacuum Chamber Cleaning ScrubPADS for light to heavy duty PM procedures
Supplier: Foamtec HT4580D83 1
Description
Ideal for wafer processing tools such as LAM 9600 and 2300 Etch chambers, Hitachi Etch chambers, TEL Etch Chambers, Varian Ion Implant Process Areas, Novellus Speed, AMAT TxZ, WxZ, DxZ, SinGEN, PolyGEN, Endura and Producer CVD, PVD tools and Roth and Rau SiNX CVD tools.
- Wide grit selection allows for quick removal of process-induced residue from aluminum, stainless steel, ceramic, glass, quartz and anodized surfaces while minimizing tool wear
- Fiber-free construction reduces particle levels in cleaned tools
- Unique bonding technology minimizes the release of abrasive particles leading to cleaner PM procedures
- Enables the elimination of H2O2 from PMs, which greatly reduces recovery times
Chemical Identifiers
| Quick removal of process induced residue from Aluminum, Stainless Steel, Ceramic, Glass, Quartz and Anodized surfaces while minimizing tool wear |
Specifications
| Vacuum Chamber Cleaning Scrub Pad | |
| Quick removal of process induced residue from Aluminum, Stainless Steel, Ceramic, Glass, Quartz and Anodized surfaces while minimizing tool wear | |
| 800 | |
| 2.25 in. | |
| Diamond |
| 1.5 x 2.25 in. | |
| Wafer processing tools | |
| Without slit | |
| 5.72 cm | |
| 0.078 in. |